In the tech world, top-tier microprocessors constantly evolve to offer peak performance. Mobile and desktop chipmakers alike have been pushing performance limits and downsizing components more and more to accommodate more transistors on a single silicon chip, seeking a persistent power increase.

However, the real challenge lies in sustaining top-notch performance. This becomes even more pertinent with space limitations inside devices such as phones and laptops, which cannot house active cooling solutions sufficiently large enough to dissipate heat at the same rate as it is generated. To address these issues, a company named xMEMS Labs recently unveiled an active micro-cooling unit that is just one-millimeter thick.

This miniscule and unobtrusive gadget may have the potential to completely change how we use our gadgets, from phones to laptops, handheld gaming PCs, consoles, and more. The company has previously been known for the world's first solid-state speakers. In these solid-state speakers, silicon structures move back and forth instead of orthodox diaphragms to generate sound.